In the fine and high-risk areas of the semiconductor industry, plastics are critical as an indispensable material for packaging and encapsulation to maintain the integrity and performance of electronic components. Choosing the right plastic material is crucial and varies according to the desired properties (robustness, wear resistance, imitation of high temperatures) and the specific application within the industry. Below are six common plastics used in semiconductors
1.Polytetrafluoroethylene (PTFE)
Properties:
High thermal stability (up to 260°C)
Exceptional chemical resistance
Low friction coefficient
Good electrical insulation
Applications:
Insulating material for high-frequency cables
Dielectric layers in RF and microwave circuits
Gaskets and seals within semiconductor manufacturing
Advantages:
Performance in extreme temperatures and chemical environments
Reduction of signal loss in high-frequency applications
2.Polytetrafluoroethylene (PTFE)
Properties:
High thermal stability (up to 260°C)
Exceptional chemical resistance
Low friction coefficient
Good electrical insulation
Applications:
Insulating material for high-frequency cables
Dielectric layers in RF and microwave circuits
Gaskets and seals within semiconductor manufacturing
Advantages:
Performance in extreme temperatures and chemical environments
Reduction of signal loss in high-frequency applications
3.Epoxy Resins
Properties:
High thermal stability
Good electrical insulation
Excellent adhesion
Resistance to moisture and chemicals
Applications:
Encapsulation of integrated circuits (ICs)
Potting and coating applications
Manufacturing of printed circuit boards (PCBs)
Advantages:
Protection against mechanical stress and environmental factors
Enhance the durability and reliability of electronic components
4.Polyethylene Naphthalate (PEN)
Properties:
High dimensional stability
Good gas and moisture barrier properties
High dielectric strength
UV resistance
Applications:
Substrates for flexible electronics
Components such as capacitors
Insulating films
Advantages:
Fit for high-frequency and high-temperature operations
Offers superior electrical insulation
5.Liquid Crystal Polymers (LCPs)
Properties:
High mechanical strength
Excellent dimensional stability
Low thermal expansion
Good flame retardancy
Applications:
Connectors and sockets
High-density interconnects (HDIs)
Flexible circuit boards
Advantages:
Suitability for miniaturized electronic components
Structural integrity maintained under high temperatures
6.Polyimides
Properties:
High thermal stability (up to 500°C)
Excellent mechanical properties
Good chemical resistance
Low dielectric constant
Applications:
Production of flexible printed circuits
Insulating layers in microelectronics
Utilization in chip-on-film (COF) technology
Advantages:
Suited for high-temperature applications
Maintains performance in harsh conditions
The use of plastics in semiconductor applications is informed by stringent standards that require impeccable thermal stability, mechanical strength, electrical insulation and resilience to environmental challenges. Epoxy resins and polyimides meet thermal and mechanical hardness requirements; Choose polycarbonate and pens for their insulation and stability; PTFE is the preferred material for high frequency and chemical resistance; The lcp was chosen for its performance in miniaturized, high-density scenarios. These plastic types meet a range of requirements that ensure the development, protection and high functionality of semiconductor devices.
